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Wafer fold wrapping machine LCM-W
  • Wafer fold wrapping machine LCM-W
  • Wafer fold wrapping machine LCM-W
  • Nuovo

Wafer fold wrapping machine LCM-W

Contract price

The machine is used for packaging of individual wafer fingers, wafer sticks and for wafer blocks.

Riferimento:
Wafer fold wrapping machine LCM-W
UPC:
EAN13:
Nuovo prodotto
Quantità
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Venduto da:
Loesch Verpackungstechnik GmbH
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Descrizione

The excellent wafer cellophane wrapping machine for full wraps at high speeds of up to 130 packages per minute. The machine is used for packaging of individual wafer fingers, wafer sticks and for wafer blocks.
Special advantages of our wafer fold wrapping machine:
Excellent wrapping quality, perfect product presentation of wafer fingers and wafer sticks
Very tight sealing by heated sealing elements
Tear thread with gripping end for easy opening
Packing these products:

Dry baked goods

 

Customer benefits: our success key factors
Well-established, robust and solid machine design
Machine layout adapted to the specific requirements of waffles
Cam-controlled with central lubrication
Very high indifference to packaging material variations through gripper feeding
Wide size range and range of application
Very flexible with regard to size changes
Computer optimized, special hardened cams
Excellent wrapping quality, perfect product presentation
Very tight sealing by heated sealing elements
Tear thread with gripping end for easy opening
Second packaging material for band wrap possible
Easy and fast changeovers
High hygiene standard
Quick cleaning and maintenance through optimum accessibility
High availability and long life

 

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