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WAFER CUTTING MACHINE
  • WAFER CUTTING MACHINE
  • WAFER CUTTING MACHINE
  • Nuovo

WAFER CUTTING MACHINE

Contract price

Wafer Cutting for separate and spread out of Wafers is used for feeding the wafer fingers as properly aligned to a chocolate enrober.

Riferimento:
WAFER CUTTING MACHINE
UPC:
EAN13:
Venduto da:
FORMA MAKİNA SANAYİ ANONİM ŞİRKETİ
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Descrizione

Wafer Cutting for separate and spread out of Wafers is placed just after the wafer cutting machine and used for feeding the wafer fingers as properly aligned to a chocolate enrober and for make them spread out so that there will be sufficient amount of transversal and longitudinal clearance between them to be coated with chocolate.

Wafer fingers are fed automatically to the chocolate enrober. Upper distribution rail group can be easily modified to comply with different product dimensions. The wafer fingers can be separated up to the 20-25 rows depending the cut dimensions, thanks to the distribution rail group. All the machine parts in contact with the product are made of stainless steel. Perforated stainless steel sheet is used at the machine entry for easy collection of cutting dust and scraps. The conveyor belts are made of polypropylene adequate to food regulations.

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